TPA751DGNR


YeeHing #: Y002-TPA751DGNR
Inventory: 3800

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Description

TPA751DGNR Texas Instruments - Yeehing Electronics

700-mW, mono, analog input, Class-AB audio amplifier in BGA packaging

Pricing (USD)

Quantity Unit Price
1 — 99 1.46
100 — 249 1.206
250 — 999 0.867
1,000 + 0.46

The above prices are for reference only.

Specifications

Manufacturer Texas Instruments
Product Category Audio Amplifiers
RoHS Y
Series TPA751
Product Audio Amplifiers
Class Class-AB
Output Power 700 mW
Mounting Style SMD/SMT
Type 1-Channel Mono
Package / Case MSOP-PowerPad-8
Audio - Load Impedance 8 Ohms
THD plus Noise 0.55 %
Supply Voltage - Max 5.5 V
Supply Voltage - Min 2.5 V
Minimum Operating Temperature - 40 C
Maximum Operating Temperature + 85 C
Packaging Reel
Description/Function Speaker
Height 1.02 mm
Input Type Differential
Length 3 mm
Output Type 1-Channel Mono
Supply Type Single
Width 3 mm
Brand Texas Instruments
Number of Channels 1 Channel
Supply Current - Max 2.5 mA
Development Kit TPA751EVM
GBP - Gain Bandwidth Product 1.4 MHz
Operating Supply Current 1.45 mA
Operating Supply Voltage 2.5 V to 5.5 V
Output Signal Type Differential
Pd - Power Dissipation 2140 mW
Product Type Audio Amplifiers
PSRR - Power Supply Rejection Ratio 85 dB
Factory Pack Quantity 2500
Subcategory Audio ICs
Unit Weight 0.000670 oz

For more information, please refer to datasheet

Documents

TPA751DGNR Datasheet

More Information

The TPA751 is a bridge-tied load (BTL) audio power amplifier developed especially for low-voltage applications where internal speakers are required. Operating with a 3.3-V supply, the TPA751 can deliver 250-mW of continuous power into a BTL 8- load at less than 0.6% THD+N throughout voice band frequencies. Although this device is characterized out to 20 kHz, its operation is optimized for narrower band applications such as wireless communications. The BTL configuration eliminates the need for external coupling capacitors on the output in most applications, which is particularly important for small battery-powered equipment. This device features a shutdown mode for power-sensitive applications with a supply current of 1.5 nA during shutdown. The TPA751 is available in a 3.0 × 3.0 mm MicroStar Junior™ (BGA), 8-pin SOIC surface-mount package and a surface-mount PowerPAD™ MSOP.

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