Description
CSD97396Q4MT Texas Instruments - Yeehing Electronics
30A Synchronous Buck NexFET Power Stage
Pricing (USD)
| Quantity | Unit Price |
| 1 — 99 | 2.079 |
| 100 — 249 | 1.717 |
| 250 — 999 | 1.233 |
| 1,000 + | 0.65 |
The above prices are for reference only.
Specifications
| Manufacturer | Texas Instruments |
| Product Category | Gate Drivers |
| RoHS | N |
| Product | Driver ICs - Various |
| Type | High Side, Low Side |
| Mounting Style | SMD/SMT |
| Package / Case | SON-9 |
| Number of Drivers | 1 Driver |
| Number of Outputs | 1 Output |
| Output Current | 30 A |
| Rise Time | 60 ns |
| Fall Time | 60 ns |
| Supply Voltage - Min | 4.5 V |
| Supply Voltage - Max | 5.5 V |
| Operating Supply Current | 7.8 mA |
| Pd - Power Dissipation | 8 W |
| Minimum Operating Temperature | - 40 C |
| Maximum Operating Temperature | + 150 C |
| Series | CSD97396Q4M |
| Packaging | Reel |
| Features | Synchronous |
| Operating Temperature Range | - 40 C to + 150 C |
| Technology | Si |
| Brand | Texas Instruments |
| Shutdown | No Shutdown |
| Moisture Sensitive | Yes |
| Product Type | Gate Drivers |
| Factory Pack Quantity | 250 |
| Subcategory | PMIC - Power Management ICs |
| Tradename | NexFET |
| Unit Weight | 0.002025 oz |
For more information, please refer to datasheet
Documents
| CSD97396Q4MT Datasheet |
More Information
The CSD97396Q4M NexFET Power Stage is a highly optimized design for use in a high-power, high-density synchronous buck converter. This product integrates the driver IC and NexFET technology to complete the power stage switching function. The driver IC has a built-in selectable diode emulation function that enables DCM operation to improve light load efficiency. In addition, the driver IC supports ULQ mode that enables connected standby for Windows 8. With the PWM input in tri-state, quiescent current is reduced to 130 µA, with immediate response. When SKIP# is held at tri-state, the current is reduced to 8 µA (typically 20 µs is required to resume switching). This combination produces a high current, high efficiency, and high speed switching device in a small 3.5 × 4.5 mm outline package. In addition, the PCB footprint is optimized to help reduce design time and simplify the completion of the overall system design.
