Description
OPA2192QDGKRQ1 Texas Instruments - Yeehing Electronics
Automotive 36-V, Precision, RRIO, Low Offset Voltage, Low Input Bias Current Op Amp With e-trim
Pricing (USD)
Quantity | Unit Price |
1 — 99 | 4.038 |
100 — 249 | 3.538 |
250 — 999 | 2.481 |
1,000 + | 1.40 |
The above prices are for reference only.
Specifications
Manufacturer | Texas Instruments |
Product Category | Operational Amplifiers - Op Amps |
RoHS | Y |
Mounting Style | SMD/SMT |
Package / Case | VSSOP-8 |
Supply Voltage - Max | 36 V |
Output Current per Channel | 65 mA |
Number of Channels | 1 Channel |
GBP - Gain Bandwidth Product | 10 MHz |
SR - Slew Rate | 20 V/us |
CMRR - Common Mode Rejection Ratio | 100 dB to 120 dB |
Ib - Input Bias Current | 5 pA |
Vos - Input Offset Voltage | 0.025 mV |
Supply Voltage - Min | 4.5 V |
Minimum Operating Temperature | - 40 C |
Maximum Operating Temperature | + 125 C |
Shutdown | No Shutdown |
Series | OPA2192-Q1 |
Qualification | AEC-Q100 |
Packaging | Reel |
Amplifier Type | Low Offset Voltage, Low Input Bias Current Amplifier |
Features | EMI Hardened, High Cload Drive |
Input Type | Rail-to-Rail |
Output Type | Rail-to-Rail |
Product | Operational Amplifiers |
Brand | Texas Instruments |
THD plus Noise | 0.00008 % |
Development Kit | DIP-ADAPTER-EVM, DIYAMP-EVM, OPAMPEVM |
en - Input Voltage Noise Density | 5.5 nV/sqrt Hz |
In - Input Noise Current Density | 1.5 fA/sqrt Hz |
Maximum Dual Supply Voltage | 18 V |
Minimum Dual Supply Voltage | 2.25 V |
Moisture Sensitive | Yes |
Product Type | Op Amps - Operational Amplifiers |
PSRR - Power Supply Rejection Ratio | 1 uV/V |
Factory Pack Quantity | 2500 |
Subcategory | Amplifier ICs |
Vcm - Common Mode Voltage | Negative Rail - 0.1 V to Positive Rail + 0.1 V |
Unit Weight | 0.001034 oz |
For more information, please refer to datasheet
Documents
OPA2192QDGKRQ1 Datasheet |
More Information
The OPAx192-Q1 family (OPA192-Q1 and OPA2192-Q1) is a new generation of 36-V, e-trim operational amplifiers. The OPAx192-Q1 family of operational amplifiers use e-trim, a method of package-level trim for offset and offset temperature drift implemented during the final steps of manufacturing after the plastic molding process. This method minimizes the influence of inherent input transistor mismatch, as well as errors induced during package molding.