TLV2171IDGKR


YeeHing #: Y001-TLV2171IDGKR
Inventory: 5800

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Description

TLV2171IDGKR Texas Instruments - Yeehing Electronics

Dual, 36-V, 3-MHz, low-power operational amplifier for cost-sensitive applications

Pricing (USD)

Quantity Unit Price
1 — 99 1.415
100 — 249 1.089
250 — 999 0.802
1,000 + 0.40

The above prices are for reference only.

Specifications

Manufacturer Texas Instruments
Product Category Operational Amplifiers - Op Amps
RoHS Y
Mounting Style SMD/SMT
Package / Case VSSOP-8
Supply Voltage - Max 36 V
Output Current per Channel 25 mA
Number of Channels 2 Channel
GBP - Gain Bandwidth Product 3 MHz
SR - Slew Rate 1.5 V/us
CMRR - Common Mode Rejection Ratio 94 dB to 105 dB
Ib - Input Bias Current 10 pA
Vos - Input Offset Voltage 2.7 mV
Supply Voltage - Min 2.7 V
Operating Supply Current 525 uA
Minimum Operating Temperature - 40 C
Maximum Operating Temperature + 125 C
Shutdown No Shutdown
Series TLV2171
Packaging Reel
Amplifier Type Low Noise Amplifier
Features Cost Optimized, EMI Hardened, High Cload Drive
Output Type Rail-to-Rail
Product Operational Amplifiers
Brand Texas Instruments
THD plus Noise 0.0002 %
en - Input Voltage Noise Density 27 nV/sqrt Hz
Ios - Input Offset Current 4 pA
Maximum Dual Supply Voltage +/- 18 V
Minimum Dual Supply Voltage +/- 1.35 V
Moisture Sensitive Yes
Product Type Op Amps - Operational Amplifiers
PSRR - Power Supply Rejection Ratio 105 dB
Factory Pack Quantity 2500
Subcategory Amplifier ICs
Unit Weight 0.000705 oz

For more information, please refer to datasheet

Documents

TLV2171IDGKR Datasheet

More Information

The 36-V TLVx171 family provides a low-power option for cost-conscious industrial and personal electronics systems requiring an electromagnetic interference (EMI)-hardened, low-noise, single-supply operational amplifier (op amp) that operates on supplies ranging from 2.7 V (±1.35 V) to 36 V (±18 V). The single-channel TLV171, dual-channel TLV2171, and quad-channel TLV4171 provide low offset, drift, quiescent current balanced with high bandwidth for the power. The devices are available in micropackages for space-constrained systems and feature identical specifications for maximum design flexibility.

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