TLV4171IPWR


YeeHing #: Y001-TLV4171IPWR
Inventory: 5400

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Description

TLV4171IPWR Texas Instruments - Yeehing Electronics

Quad, 36-V, 3-MHz, low-power operational amplifier for cost-sensitive applications

Pricing (USD)

Quantity Unit Price
1 — 99 1.926
100 — 249 1.591
250 — 999 1.143
1,000 + 0.60

The above prices are for reference only.

Specifications

Manufacturer Texas Instruments
Product Category Operational Amplifiers - Op Amps
RoHS Y
Mounting Style SMD/SMT
Package / Case TSSOP-14
Supply Voltage - Max 36 V
Output Current per Channel 25 mA
Number of Channels 4 Channel
GBP - Gain Bandwidth Product 3 MHz
SR - Slew Rate 1.5 V/us
CMRR - Common Mode Rejection Ratio 94 dB to 105 dB
Ib - Input Bias Current 10 pA
Vos - Input Offset Voltage 2.7 mV
Supply Voltage - Min 2.7 V
Operating Supply Current 525 uA
Minimum Operating Temperature - 40 C
Maximum Operating Temperature + 125 C
Shutdown No Shutdown
Series TLV4171
Packaging Reel
Amplifier Type Low Power Amplifier
Features Cost Optimized, EMI Hardened, High Cload Drive
Output Type Rail-to-Rail
Product Operational Amplifiers
Brand Texas Instruments
THD plus Noise 0.0002 %
en - Input Voltage Noise Density 16 nV/sqrt Hz
Ios - Input Offset Current 4 pA
Maximum Dual Supply Voltage +/- 18 V
Minimum Dual Supply Voltage +/- 1.35 V
Moisture Sensitive Yes
Product Type Op Amps - Operational Amplifiers
PSRR - Power Supply Rejection Ratio 105 dB
Factory Pack Quantity 2000
Subcategory Amplifier ICs
Unit Weight 0.006102 oz

For more information, please refer to datasheet

Documents

TLV4171IPWR Datasheet

More Information

The 36-V TLVx171 family provides a low-power option for cost-conscious industrial and personal electronics systems requiring an electromagnetic interference (EMI)-hardened, low-noise, single-supply operational amplifier (op amp) that operates on supplies ranging from 2.7 V (±1.35 V) to 36 V (±18 V). The single-channel TLV171, dual-channel TLV2171, and quad-channel TLV4171 provide low offset, drift, quiescent current balanced with high bandwidth for the power. The devices are available in micropackages for space-constrained systems and feature identical specifications for maximum design flexibility.

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