Description
TPA4860D Texas Instruments - Yeehing Electronics
1-W, mono, Class-AB audio amplifier with headphone interface logic
Pricing (USD)
| Quantity | Unit Price |
| 1 — 99 | 1.792 |
| 100 — 249 | 1.48 |
| 250 — 999 | 1.063 |
| 1,000 + | 0.56 |
The above prices are for reference only.
Specifications
| Manufacturer | Texas Instruments |
| Product Category | Audio Amplifiers |
| RoHS | Y |
| Series | TPA4860 |
| Product | Audio Amplifiers |
| Class | Class-AB |
| Output Power | 1 W |
| Mounting Style | SMD/SMT |
| Type | 1-Channel Mono |
| Package / Case | SOP-16 |
| Audio - Load Impedance | 8 Ohms |
| THD plus Noise | 0.4 % |
| Supply Voltage - Max | 5.5 V |
| Supply Voltage - Min | 2.7 V |
| Minimum Operating Temperature | - 40 C |
| Maximum Operating Temperature | + 85 C |
| Packaging | Tube |
| Description/Function | Speaker |
| Height | 1.58 mm |
| Input Type | Single |
| Length | 9.9 mm |
| Output Type | 1-Channel Mono |
| Supply Type | Single |
| Width | 3.91 mm |
| Brand | Texas Instruments |
| Number of Channels | 1 Channel |
| Development Kit | TPA4860EVM |
| GBP - Gain Bandwidth Product | 1.5 MHz |
| Operating Supply Current | 3.5 mA |
| Operating Supply Voltage | 2.7 V to 5.5 V |
| Output Signal Type | Differential |
| Pd - Power Dissipation | 1250 mW |
| Product Type | Audio Amplifiers |
| PSRR - Power Supply Rejection Ratio | 75 dB |
| Factory Pack Quantity | 40 |
| Subcategory | Audio ICs |
| Unit Weight | 0.005471 oz |
For more information, please refer to datasheet
Documents
| TPA4860D Datasheet |
More Information
The TPA4860 is a bridge-tied load (BTL) audio power amplifier capable of delivering 1 W of continuous average power into an 8- load at 0.4 % THD+N from a 5-V power supply in voiceband frequencies (f < 5 kHz). A BTL configuration eliminates the need for external coupling capacitors on the output in most applications. Gain is externally configured by means of two resistors and does not require compensation for settings of 2 to 20. Features of this amplifier are a shutdown function for power-sensitive applications as well as headphone interface logic that mutes the output when the speaker drive is not required. Internal thermal and short-circuit protection increases device reliability. It also includes headphone interface logic circuitry to facilitate headphone applications. The amplifier is available in a 16-pin SOIC surface-mount package that reduces board space and facilitates automated assembly.
