TPA721DGN Texas Instruments - Yeehing Electronics

700-mW, mono, analog input, Class-AB audio amplifier

Pricing (USD)

Quantity	Unit Price
1 — 99	1.196
100 — 249	0.988
250 — 999	0.71
1,000 +	0.37

The above prices are for reference only.

Specifications

Manufacturer	Texas Instruments
Product Category	Audio Amplifiers
RoHS	Y
Series	TPA721
Product	Audio Amplifiers
Class	Class-AB
Output Power	700 mW
Mounting Style	SMD/SMT
Type	1-Channel Mono
Package / Case	MSOP-PowerPad-8
Audio - Load Impedance	8 Ohms
THD plus Noise	0.55 %
Supply Voltage - Max	5.5 V
Supply Voltage - Min	2.5 V
Minimum Operating Temperature	- 40 C
Maximum Operating Temperature	+ 85 C
Packaging	Reel
Description/Function	Speaker
Height	1.02 mm
Input Type	Single
Length	3 mm
Output Type	1-Channel Mono
Supply Type	Single
Width	3 mm
Brand	Texas Instruments
Number of Channels	1 Channel
Supply Current - Max	2.5 mA
Operating Supply Current	1.25 mA
Operating Supply Voltage	2.5 V to 5.5 V
Output Signal Type	Differential
Pd - Power Dissipation	2140 mW
Product Type	Audio Amplifiers
PSRR - Power Supply Rejection Ratio	85 dB
Factory Pack Quantity	2500
Subcategory	Audio ICs
Unit Weight	0.000670 oz

For more information, please refer to datasheet

Documents

TPA721DGN Datasheet

More Information

The TPA721 is a bridge-tied load (BTL) audio power amplifier developed especially for low-voltage applications where internal speakers are required. Operating with a 3.3-V supply, the TPA721 can deliver 250-mW of continuous power into a BTL 8- load at less than 0.6% THD+N throughout voice band frequencies. Although this device is characterized out to 20 kHz, its operation is optimized for narrower band applications such as wireless communications. The BTL configuration eliminates the need for external coupling capacitors on the output in most applications, which is particularly important for small battery-powered equipment. This device features a shutdown mode for power-sensitive applications with a supply current of 7 µA during shutdown. The TPA721 is available in an 8-pin SOIC surface-mount package and the surface-mount PowerPAD MSOP, which reduces board space by 50% and height by 40%.