Texas Instruments
TPS650860A0RSKT
TPS650860A0RSKT
Couldn't load pickup availability
TPS650860A0RSKT Texas Instruments - Yeehing Electronics
Configurable multi-rail PMIC for 2S & 3S Li-ion battery-operated devices or non battery operated
Pricing (USD)
| Quantity | Unit Price |
| 1 — 99 | 8.444 |
| 100 — 249 | 6.884 |
| 250 — 999 | 5.41 |
| 1,000 + | 3.67 |
The above prices are for reference only.
Specifications
| Manufacturer | Texas Instruments |
| Product Category | Power Management Specialized - PMIC |
| RoHS | Y |
| Minimum Operating Temperature | - 40 C |
| Maximum Operating Temperature | + 85 C |
| Mounting Style | SMD/SMT |
| Package / Case | VQFN-64 |
| Type | Configurable Multirail PMU |
| Packaging | Reel |
| Application | X86, ARM, FPGA |
| Operating Temperature Range | - 40 C to + 85 C |
| Product | PMIC Solutions |
| Series | TPS650860 |
| Brand | Texas Instruments |
| Moisture Sensitive | Yes |
| Operating Supply Voltage | 5 V |
| Product Type | Power Management Specialized - PMIC |
| Factory Pack Quantity | 250 |
| Subcategory | PMIC - Power Management ICs |
| Unit Weight | 0.008021 oz |
For more information, please refer to datasheet
Documents
| TPS650860A0RSKT Datasheet |
More Information
The TPS650860 device is a single-chip power-management IC designed for multicore processors, FPGAs, and other System-on-Chips (SoCs). The TPS650860 offers an input range of 5.6 V to 21 V, enabling a wide range of applications. The device is well suited for NVDC and non-NVDC power architecture using 2S, 3S, or 4S Li-Ion battery packs. See the Application Section for 5-V input supplies. The D-CAP2 and DCS-Control high-frequency voltage regulators use small inductors and capacitors to achieve a small solution size. The D-CAP2 and DCS-Control topologies have excellent transient response performance, which is great for processor core and system memory rails that have fast load switching. An I2C interface allows simple control either by an embedded controller (EC) or by an SoC. The PMIC comes in an 8-mm × 8-mm, single-row VQFN package with thermal pad for good thermal dissipation and ease of board routing.
