Description
TPS6508700RSKT Texas Instruments - Yeehing Electronics
PMIC for AMD™ family 17h models 10h-1Fh processors
Pricing (USD)
Quantity | Unit Price |
1 — 99 | 5.714 |
100 — 249 | 4.991 |
250 — 999 | 3.848 |
1,000 + | 2.41 |
The above prices are for reference only.
Specifications
Manufacturer | Texas Instruments |
Product Category | Power Management Specialized - PMIC |
RoHS | Y |
Output Voltage Range | 0.425 V to 5 V |
Output Current | 200 mA, 500 mA, 600 mA, 3 A |
Input Voltage Range | 5.6 V to 21 V |
Minimum Operating Temperature | - 40 C |
Maximum Operating Temperature | + 85 C |
Mounting Style | SMD/SMT |
Package / Case | VQFN-64 |
Type | PMIC |
Packaging | Reel |
Application | AMD Family 17h Model 10h-1Fh |
Operating Temperature Range | - 40 C to + 85 C |
Product | PMICs |
Series | TPS6508700 |
Brand | Texas Instruments |
Development Kit | TPS650860EVM-116 |
Moisture Sensitive | Yes |
Product Type | Power Management Specialized - PMIC |
Factory Pack Quantity | 250 |
Subcategory | PMIC - Power Management ICs |
Unit Weight | 0.005475 oz |
For more information, please refer to datasheet
Documents
TPS6508700RSKT Datasheet |
More Information
The TPS6508700 device is a single-chip power-management IC (PMIC) designed for the AMD™ Family 17h Models 10h-1Fh processors targeted for notebooks and all-in-one desktops. The TPS6508700 device offers an input range from 5.6 V to 21 V, enabling use in a wide range of applications. The device is well suited for NVDC and non-NVDC power architecture using 2S, 3S, or 4S Li-Ion battery packs. The D-CAP2™ and DCS-Control™ high-frequency voltage regulators use small inductors and capacitors to achieve a small solution size. The D-CAP2 and DCS-Control topologies have excellent transient response performance, which is optimal for processor core and system memory rails that have fast load switching. An I2C interface allows simple control either by an embedded controller (EC) or by a system on chip (SoC). The PMIC comes in an 8-mm × 8-mm, single-row VQFN package with thermal pad for good thermal dissipation and ease of board routing.