TPS71913-28DRVT Texas Instruments - Yeehing Electronics

200-mA, low-IQ, high-PSRR, dual-channel low-dropout voltage regulator with active pulldown

Pricing (USD)

Quantity	Unit Price
1 — 99	1.676
100 — 249	1.384
250 — 999	0.994
1,000 +	0.52

The above prices are for reference only.

Specifications

Manufacturer	Texas Instruments
Product Category	LDO Voltage Regulators
RoHS	Y
Mounting Style	SMD/SMT
Package / Case	WSON-6
Output Voltage	1.3 V, 2.8 V
Output Current	200 mA
Number of Outputs	2 Output
Polarity	Positive
Input Voltage MAX	6.5 V
Input Voltage MIN	2.7 V
Output Type	Fixed
Minimum Operating Temperature	- 40 C
Maximum Operating Temperature	+ 125 C
Dropout Voltage	230 mV
Series	TPS71913-28
Packaging	Reel
Height	0.75 mm
Length	2 mm
Operating Temperature Range	- 40 C to + 125 C
Width	2 mm
Brand	Texas Instruments
Dropout Voltage - Max	400 mV at 200 mA
Voltage Regulation Accuracy	2.5 %
Ib - Input Bias Current	90 uA
Line Regulation	130 uV / V
Load Regulation	75 uV/mA
Operating Supply Current	90 uA
Pd - Power Dissipation	1.053 W
Product Type	LDO Voltage Regulators
Factory Pack Quantity	250
Subcategory	PMIC - Power Management ICs
Unit Weight	0.000342 oz

For more information, please refer to datasheet

Documents

TPS71913-28DRVT Datasheet

More Information

The TPS718xx and TPS719xx families of low-dropout (LDO) regulators offer a high power-supply rejection ratio (PSRR), low noise, fast start-up, and excellent line and load transient responses while consuming a very low 90µA (typical) at no load ground current with both LDOs enabled. The TPS719xx also provides an active pulldown circuit to quickly discharge output loads. The TPS718xx and TPS719xx are stable with ceramic capacitors and use an advanced BiCMOS fabrication process to yield a typical dropout voltage of 230mV at 200mA output loads. The TPS718xx and TPS719xx also use a precision voltage reference and feedback loop to achieve 3% overall accuracy over all load, line, process, and temperature variations. Both families of devices are fully specified from TJ = -40°C to +125°C and are offered in 2mm × 2mm SON-6 and 6-ball Wafer Chip-Scale (WCSP) packages that are ideal for applications such as mobile handsets and WLAN that require good thermal dissipation while maintaining a very small footprint.